In our work we have the following situation:

-we used AZ 1518 (or AZ 1512 HS) photoresist
(MicroChemicals GmbH) and AZ 400k developer for
lithographic process.

-for wet etching of Ni film we used 20% HNO3 solution
(and others) that causes damages of  Sb deposited film
protected with photoresist.

Please send us your recommendations about using of
these photoresists in wet etching process of Ni film.

Thank you