Hello everybody,

we tried the photoresist EPON SU-8 epoxy resin; according to
informations in 'Micromachine Devices' and data sheets coming with the
resist, suitable developer is XPSU8 (PGMEA). The solvent for the resin
is GBL - gamma-butyloracton.
>From the supplier we got no hints to the SU8-remover, but the (funny)
advices only to lift the resist using a sacrifical thin resist layer
underneath the SU8 - or simply to leave it on the wafer  :-(
Fatal is the fact, that the resist, if once polymerized, cannot be
dissolved and removed by any means (solvent, EKC270, Aceton etc.).

Has anyone experience in processing SU8 and to dissolve this resist if
polymerized??

Any response is appreciated
Tanks in advance
Arno Steckenborn


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