I am working with SU-8, 2050, photoresist. I am trying to create 30 micron
diameter vias using SU-8 for copper posts. After expose and develop I notice
that I see cracks around the edge of the vias. Has anyone come accross this
problem? if so, what was the solution. Thanks for your help.
Jitendra Patel

p.s. I am following the processing step as recommend by MicroChem. This is my
process
Clean wafer, Baked, Sputter Ti/Cu/Ti, apply omnicoat, baked, apply SU-8 2050,
soft bake, expose using 365nm UV light source, Post expose bake, let it sit
overnight, Develop SU-8 using SU-8 developer, Develop omnicoat using de-scum.