> Date:          Wed, 27 May 1998 08:54:11 +0100
> From:          Colin Ashruf 
> Subject:       Gold/silicon adhesion in KOH/TMAH
[...]
> What kind of metal process do I need to get a gold layer on silicon
> which survives KOH or TMAH at high temperatures. We have tried
> evaporated Au/Cr but that comes of after a few hours?
> If you can help me please e-mail: [email protected]

You do not really need an intermediate layer between Au and Si if you
can live with interdiffusion. Generally, the Cr-Au-system is not
stable; I recommend you to use TiW-Au instead.
Yours sincerely, Kai Hiltmann

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