Dwayne,

What do you mean, exactly, when you mention placing "sensitive
surfaces"?  In one way, it sounds as if you are looking at placing some
sort of non-polymer device, such as a CMOS or MEMS chip, onto a
fabricated microfuidic device (PDMS, COC, polycarbonate, PMMA).
Depending on the arrangement you wish to do this in, a couple of
approaches could be taken:

1) Large scale (similar to wafer scale) - traditional wafer-level
bonding process: There has been quite a bit of work done with bonding of
polymers to silicon, GaAs, and other substrate materials.

2) Small device - large scale (Chip-to-wafer): One adaptation that has
been nade recently has been the concept of combining a chip-mounting
system with a wafer bonding system.  The chip-mount handles the
placement of discrete items onto a wafer-scale substrate (perhaps your
microfuidic device), while the bonding system has adaptive pressure
application, allowing for uniform bonding of asymmetrically placed die.
A setup such as this was developed in conjunction between DataCON and
EVG.

3) Small device - small device - in this case, the approach would again
be similar to the wafer - to - wafer approach.

Best Regards,
Chad Brubaker


-----Original Message-----
From: Dwayne Dunaway
Sent: Friday, October 28, 2005 10:46 PM
To: [email protected]
Subject: [mems-talk] attaching surfaces to devices

Does anyone have any suggestions on how to attach sensitive surfaces to
microfluidic devices fabricated out of plastic or polymers?