A MEMS Clearinghouse® and information portal
for the MEMS and Nanotechnology community
RegisterSign-In
MEMSnet Home About Us What is MEMS? Beginner's Guide Discussion Groups Advertise Here
News
MEMSnet Home: MEMS-Talk: 1737 bonding with temperature below 650C
1737 bonding with temperature below 650C
2005-11-21
Zhang Peng
2005-11-21
Brubaker Chad
SU8 maximum aspect ratio
2005-12-08
erkin seker
2005-12-13
Ren Yang
1737 bonding with temperature below 650C
Zhang Peng
2005-11-21
Dear all,

I intend to bond two 1737 glass wafers together. Since anodic bonding can
not be used, is it practical to fusion bond them? Should you have any
experience or refences on it, pls share with me. Suggestions are also
welcome. Thanks a lot.

Best,

ZHANG Peng


reply
Events
Glossary
Materials
Links
MEMS-talk
Terms of Use | Contact Us | Search
MEMS Exchange
MEMS Industry Group
Coventor
Harrick Plasma
Tanner EDA
University Wafer
Nano-Master, Inc.
Process Variations in Microsystems Manufacturing
The Branford Group