Zhang Peng,

One method would be the use of plasma activation.  Please see the
reference below

V. Dragoi, S. Farrens, P. Lindner, J. Weixlberger, "Low Temperature
Wafer Bonding for Microsystems Applications," Proceedings of IEEE CAS
2004, October 4 - 6, Sinaia, Romania

I will forward a copy to you shortly.

Best Regards,
Chad Brubaker


-----Original Message-----
From: [email protected]
[mailto:[email protected]] On Behalf Of Zhang Peng
Sent: Monday, November 21, 2005 5:17 AM
To: [email protected]
Subject: [mems-talk] 1737 bonding with temperature below 650C

Dear all,

I intend to bond two 1737 glass wafers together. Since anodic bonding
can
not be used, is it practical to fusion bond them? Should you have any
experience or refences on it, pls share with me. Suggestions are also
welcome. Thanks a lot.