Lawrence,
    Strong bases such as KOH will likely do the trick on fully cured
polyimide but of course it is likely to attack your wafer as well. One
trick we sometimes use, particularly if you are not using an adhesion
promoter, is to simply boil the sample in DI and the entire PI layer
should come right off. Though if you haven't tried it, an O2 plasma will
not attack Au. You might see some sputtering if you are not careful
about the magnitude of the DC bias in the plasma.

-Michael
  U. of Louisville

>>> [email protected] 11/22/05 10:03 PM >>>
How to remive the fully or soft-bake polyimide but not use O2 plasma,
because I
pattern a gold layer and I don't want to attack it.
Can I use any strong acid or base to remove it?