Hello,

I am trying to anodically bond a micromachined Si device to a
micromachined borosilicate glass substrate.  For this application,
alignment is not an issue.  We are using a hot plate with a high voltage
power supply.  The way we typically perform anodic bonding is to attach
Cu wires to the glass substrate and the Si substrate with conductive
epoxy, then heat the stack to 310C and apply a 400V pulse.  This usually
gives very good results.  However, for this application we cannot use
conductive epoxy on the Si device.  Does anyone have a suggestion for
how to electrically connect to the Si and glass substrates without using
conductive epoxy.  Thanks.

Sincerely,

Robert Dean
Auburn University