For similar applications, I've put the silicon on the bottom on a conductive
chuck, and simply put a probe on the glass.
It's that simple.
The glass seems to be conductive enough at high temperature to get a good
bond all the way across the silicon.
    --Kirt Williams

----- Original Message -----
From: "Robert Dean" 
To: 
Sent: Friday, December 02, 2005 2:49 PM
Subject: [mems-talk] anodic bonding question


> Hello,
>
> I am trying to anodically bond a micromachined Si device to a
> micromachined borosilicate glass substrate.  For this application,
> alignment is not an issue.  We are using a hot plate with a high voltage
> power supply.  The way we typically perform anodic bonding is to attach
> Cu wires to the glass substrate and the Si substrate with conductive
> epoxy, then heat the stack to 310C and apply a 400V pulse.  This usually
> gives very good results.  However, for this application we cannot use
> conductive epoxy on the Si device.  Does anyone have a suggestion for
> how to electrically connect to the Si and glass substrates without using
> conductive epoxy.  Thanks.
>