We recently  developed a plasma etch system that is configured with a  new
very high density source plus rie capability. Our initial testing on  standard
cross-linked polyimide shows etch rates > 10 micron/minute at low  temperatures
of <100 degrees C. Is there anyone out there who would be  willing to partner
with us to run the same experiments with hard to remove SU-8  applications?
The same system could be used to etch either Micro Chems or Brewer  Science
PIRL lift-off materials that are used under SU-8. This method is used  for
lifting off SU-8 after processing employing wet solvent chemistries. Please
contact
me directly at my email if you are interested

Bob Henderson-Etched In Time, Inc
[email protected]