Hi
Use RIE in oxygen plasma if you have this facility.

Best regards
Prem Pal
Yonsei University Seoul, South Korea

On Wed, 21 Dec 2005 Sven Holmstrvm wrote :
>Hi
>
>We have a problem regarding the removal of resist.
>
>We have two wafers with memsstructure of aliminum and gold
>respectively. We want to release them by etching a sacrificial crome
>layer. On top of the crome a protective layer of Shipley's S1813
>resist was put to protect the wafers durings transport.
>
>The resist was only softbaked after spinning.
>
>What obviously happened was that the wafers were stored for too long
>(around six moths) and now the resist can't be stripped by acetone,
>which is what we normally use.
>
>Can anyone here think of any other way to remove the resist? It might
>be possible to etch itm but most ethcants etch metals faster than
>resists, which would be a big problem.