As far as I know, most of the IPA will always float on top of the KOH. However,
a small amount of the IPA will dissolve, and this should be enough for both
changing the anisotropy properties and reduce
undercutting.

Good luck!

Karin

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Dr. Karin Hermansson
European Marketing Manager
BCO Technologies PLC
339 Glen Road
Belfast BT11 8BU
United Kingdom
Tel: +44 1232 615599
Fax: +44 1232 616788
Mob: +44 410 423479
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-----Original Message-----
From:    PC :[email protected] [SMTP:PC :[email protected]]
Sent:   Thursday, June 11, 1998 8:15 AM
To:      [email protected];  [email protected];  Karin.Hermansson
@BCO-Technologies.com
Subject:        anisotropic etching of <100> wafers

I have got some questions regarding to anisotropic etching of  <100>
wafers
we are etching v-grooves on 4" <100> wafers.  there are some problems
about  silicon undercutting.
I heard that isopropyl alcohol may be added to reduce the undercutting.
but Isopropyl alcohol does not mix with water .
We are now using KOH+ D.I water etchant  and considering new method to
add  isopropyl alcohol.
I want to know the way to mix with isopropyl alcohol. we tried some
methods using stirrer etc but failed.
If you have a good method. please tell me the method as soon as
possible!



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