Can anybody suggest a good way to temporarily bond a silicon wafer to a handle
wafer when through wafer etching with a DRIE system?

Ideally, this should be something that can be spread on the handle to a uniform
thickness and make a good thermal contact. It should also be easy to remove
afterwards using heat and/or solvent, leaving no residue on the wafer.

I've tried photo-resist, but I'm worried that the thermal contact is not very
good.

Regards,

Martin.