Dear Brubaker,

I have a wafer bonding question that I hope someone can give me some help.
I need to bond a plastic substrate onto glass substrate for regular
lithography, deposition, and etching processes with temperature up to
150C. Then after all the processes, I need to de-bond the plastic subtrate
from glass. Do you have any good method and bonding material to recommend
for my process? You mentioned about BCB as bonding material in previous
message. I have BCB but I want to make sure that it can sustain long
exposure in most etchants (KOH, HF, PAN) and solvents (acetone,
positive resist stripper) during the process but can be dissolved by its
own stripper after the process. Thanks in advance for any suggestions.


Best regards,

Isaac Chan, Ph.D.


On Mon, 24 Jan 2005, Brubaker Chad wrote:

> There are actually a few different approaches that are available in a
situation like this - it depends on what the processes are after the bonding
step.
>
> In the situation you are listing, it sounds as if you will need a highly
uniform bonding surface, so you will most likely want a spin-on material of some
sort as your intermediate layer. As was mentioned in earlier posts, BCB can make
a good bonding agent for such a process, but in general, there is any variety of
materials that might be able to suit (even various photoresists).  The primary
requisite is that the material be able to survive the thinning process, which is
why BCB could have an advantage. If care is taken with the coating and bonding
process, the BCB should still remain solvent releasable.
>
> Best Regards,
> Chad Brubaker