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MEMSnet Home: MEMS-Talk: wafer bonding
wafer bonding
2006-01-11
Isaac Chan
2006-01-11
[email protected]
2006-01-12
Brubaker Chad
wafer bonding
[email protected]
2006-01-11
Isaac:

I have just seen a system approach that might well work for your plastic to
glass bonding application. It consists of a tool that spins on a special
material cures it and then bonds the two substrates together. Processing can
then
be completed and I believe up to 180 degrees C is the max temperature. Once
processing is complete another system does a laser rastering to break the
adhesive bond leaving little residue. This system is located here in Phoenix and
if you want to contact me directly at 602-206-6154 I can hook you up with the
 company that is providing foundry services for the bonding/debonding.

Bob Henderson 602-206-6154
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