Hi Martin,

If one of your wafers can be transparent (glass) you can use a UV release
tape, or if the temperature during your etching process is less than 190C
you can try to temporary bond the two wafers using a thermal release tape
(Revalpha 3195V NITTO).

Regards
Noemi

-----Original Message-----
From: [email protected] [mailto:[email protected]]
On Behalf Of Martin J Prest
Sent: Wednesday, January 11, 2006 5:16 PM
To: [email protected]
Subject: [mems-talk] temporary wafer bond?


Can anybody suggest a good way to temporarily bond a silicon wafer to a
handle wafer when through wafer etching with a DRIE system?

Ideally, this should be something that can be spread on the handle to a
uniform thickness and make a good thermal contact. It should also be easy to
remove afterwards using heat and/or solvent, leaving no residue on the
wafer.

I've tried photo-resist, but I'm worried that the thermal contact is not
very good.

Regards,

Martin.