I'm not entirely sure of the chemical resistance of BCB to the etchants
listed - my biggest concern would be the KOH, since BCB does have a
silicon element to it.  It should be fine with the litho solvents. You
might want to check directly with Dow:

www.dow.com/cyclotene



Best Regards,
Chad Brubaker



-----Original Message-----
From: [email protected]
[mailto:[email protected]] On Behalf Of Isaac Chan
Sent: Wednesday, January 11, 2006 12:12 PM
To: Brubaker Chad
Cc: General MEMS discussion
Subject: RE: [mems-talk] wafer bonding

Dear Brubaker,

I have a wafer bonding question that I hope someone can give me some
help.
I need to bond a plastic substrate onto glass substrate for regular
lithography, deposition, and etching processes with temperature up to
150C. Then after all the processes, I need to de-bond the plastic
subtrate
from glass. Do you have any good method and bonding material to
recommend
for my process? You mentioned about BCB as bonding material in previous
message. I have BCB but I want to make sure that it can sustain long
exposure in most etchants (KOH, HF, PAN) and solvents (acetone,
positive resist stripper) during the process but can be dissolved by its
own stripper after the process. Thanks in advance for any suggestions.


Best regards,

Isaac Chan, Ph.D.