Dear Martin,

I have etched several through-wafer etching upto 500 um thick with a feature
size of 20 um.

i use 7 um Az9260 photoresist to bond device and dummy wafers. Just preheat
them at 100 C for about 10 mins.

Pradeep


On 1/12/06, Martin J Prest  wrote:
>
> Can anybody suggest a good way to temporarily bond a silicon wafer to a
> handle wafer when through wafer etching with a DRIE system?
>
> Ideally, this should be something that can be spread on the handle to a
> uniform thickness and make a good thermal contact. It should also be easy to
> remove afterwards using heat and/or solvent, leaving no residue on the
> wafer.
>
> I've tried photo-resist, but I'm worried that the thermal contact is not
> very good.
>
> Regards,
>
> Martin.