Linas,
20 nm Ti or Cr + 600...1000 nm Cu or Ag is ok
regards
Peter

Jauniskis, Linas wrote:

>Could anyone suggest an evaporated metallization (metal layers &
>thickness) recipe on glass & ceramics (alumina) that one can solder to
>with SnPb 63/37 and SnAg 96.5/3.5 solders.
>Thanks!
>Linas.