Linas,

  gold is the best metal for the soldering and of course Cr or Ti should be
deposited before gold deposition. With my experience, gold thickness should be
thicker than 0.5 micro meter for the soldering. If it is too thin then it is
very hard to solder and very easy to peeled off when you do the soldering. For
the safe soldering, I recommend thicker than 1 micro meter deposition and I
perfer electroplating as it make strong bonding surface. Evaporator may not be
suitable for the soldering.....

  sokwon

"Jauniskis, Linas"  wrote:
  Could anyone suggest an evaporated metallization (metal layers &
thickness) recipe on glass & ceramics (alumina) that one can solder to
with SnPb 63/37 and SnAg 96.5/3.5 solders.
Thanks!
Linas.