I'd be wary of soldering to just Ti/Au with SnPb.  The lead can aggressively
attack the gold during soldering, and eat away a substantial portion of it,
forming a brittle, poorly conductive Gold/Lead mixture.

A good recipe would have an adhesion layer, some nickel, and then a thin
layer of gold on top.

I don't have experience with SnAg solder, but other solders besides SnPb do
NOT necessarily attack gold in this way.


David Nemeth
Senior Engineer
Sophia Wireless, Inc.
14225-C Sullyfield Circle
Chantilly, VA 20151

-----Original Message-----
From: [email protected]
[mailto:[email protected]]On Behalf Of Jauniskis, Linas
Sent: Monday, January 23, 2006 9:22 AM
To: General MEMS discussion
Subject: [mems-talk] Solderable metallization recipe on glass & ceramics


Could anyone suggest an evaporated metallization (metal layers &
thickness) recipe on glass & ceramics (alumina) that one can solder to
with SnPb 63/37 and SnAg 96.5/3.5 solders.
Thanks!
Linas.