I am doing bulk-micromacining of silicon structure in KOH, protecting the
structure with Chrome- Gold(1 micron thick - ebeam evaporated ;using lift off
process). After bulk-micromachining I find bubbles in gold layer(may be because
of pin holes) and silicon is getting attacked. Can someone suggest how to get
rid of these pin holes?

Thanks & Regards!

Manoj Wadhwa
SCL-India