Hi
  Please check my procedure.
  1.Coat PMMA
  2. EBL for pattern (Not yet developed)
  3. Coat S1818
  4. UV exposure(will not do the hard bake for further purpose)
  4. Develope of S1818 with MF319
  5. Develope PMMA
  6. UV exposure to whole wafer 300mJ/cm2
  7. Develope S1818

  I wonder whether S1818 developer attack the PMMA layer or not......or vice
versa

  Thanks.

  sokwon