Dear All,

I am a brand new member of Mems Exchange. It is really very nice to
have such a community to seek microprocessing advise.

My question :

1. I have a trench that it 3 microns deep and 30 microns wide. Can a
uniform coating of this trench be obtained by spin coating standard
photoresist ? What is the highest aspect ratio feature that can be
uniformly coated with standard photoresist ?

2. Is it possible to reliably fill an isolation trench that is 3
microns deep and 30 microns wide with CVD grown SiO2 ?

Thank you very much for the help !

Kamesh