Hai all

I am designing a capacitive acceleromete. My question is can I use metal
layer as the interconnect to fixed electrodes and to feed excitation? Which
metal layer is preferred?

My fab flow is
 wafer definition
Deposit silicon nitride
Deposit metal
etch metal
Deposit silicon dioxide
etch siO2
deposit polysilicon
etch poly
sacrifice  siO2

If anybody wants 3D pics I can send


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Trinadh.A
Scientist
Research and Development Establishment
Defence Research and Development Organisation, India