Hi,
I'm a new subscriber to this mems-talk group and I'm not sure that my message
has been sent the first time. Sorry if it's the second time you receive it.

I'm looking for a kind of encapsulant to use with wire bonding. It is for a MEMS
application. It should cover entirely wires. It has to insulate wires
electrically, but also be quite hard to accept pressure like a gentle
pushing of a finger. The material after cure has to become as wide as high due
to wires specifications and alignment. It cannot cures at high
temperatures(maximum aroud 170 Celsius). I think that NoSweep from Polyscience
should match my needs but I'm not sure. Does anyone know other products that
could help me to solve my problem? Is NoSweep a good solution for my problem?

Thank you
Sincerely yours
Frank