Hello,

These companies offer a wide range of wirebonding encapsulants:

        1) Ablestik  www.ablestik.com
        2) Loctite www.loctite.com  (choose electronics)

Others exist, but these are OK.  Good luck.

Sébastien Allard
------------------------------------------
R&D Process Engineer
LxSix Photonics

-----Original Message-----
From: [email protected] [mailto:[email protected]] On
Behalf Of François Therriault Proulx
Sent: 9 février 2006 13:21
To: [email protected]
Subject: [mems-talk] Encapsulant for wire bonding

Hi,
I'm a new subscriber to this mems-talk group and I'm not sure that my message
has been sent the first time. Sorry if it's the second time you receive it.

I'm looking for a kind of encapsulant to use with wire bonding. It is for a MEMS
application. It should cover entirely wires. It has to insulate wires
electrically, but also be quite hard to accept pressure like a gentle pushing of
a finger. The material after cure has to become as wide as high due to wires
specifications and alignment. It cannot cures at high temperatures(maximum aroud
170 Celsius). I think that NoSweep from Polyscience should match my needs but
I'm not sure. Does anyone know other products that could help me to solve my
problem? Is NoSweep a good solution for my problem?