Dear Mark & Mems Friends,
I have a suggestion that may help with many of
your formulations.
We are currently developing an electroless process
for depositing conductors onto ceramics and metal
using our nanopowders as well as away of laser
bonding them. We manufacture energetic nanosize
metal powders that can readily bond to metal and
ceramic substrates. The powders have a metastable
structure and undergo morphological transformation
at relatively low temperatures, releasing heat and
creating fresh surfaces.   When the powders
exotherm, they are very reactive with substrates
and under appropriate conditions, they will form
adherent coatings.  We have been able to bond
several conductors to alumina and glass and with
the collaboration of Sandia National Laboratory,
we have been able to deposit conductive copper
patterns onto glass with a resolution of about 10
microns.
Aluminum has been successfully bonded onto silicon
wafers with excellent ohmic contact.


Cindi Prorok - R & D
Argonide Corporation
[email protected]
http://www.argonide.com