Sputtering may not work as the Su-8 couldnot be
exposed to higher temperatures.So you can go with
electroless plating of Cr/Ti .Thats better. Then go
for the electroplating.

Cr forms oxide too.So you have tp take steps to remove
CR oxide otherwise Cr oxide is bad conductor and
adhesion with Cu will be a prob.

Bala.

--- Iskandar Samad  wrote:

> Hi all, Im looking to electroplate some copper onto
> SU-8 photoresist and
> was wondering if anyone has had experience with
> this. Btw, the SU-8 has
> been prepatterned and cured on a silicon wafer.
>
> Are there any issues about whether the
> sputtered/evaporated seed layer
> (for plating) adheres well to the SU-8, and if so
> what material seed
> would you suggest? Is there any material I could pre
> deposit that could
> perhaps aid adhesion?