Copper should be beter as seed layer than aluminium
because of the low EMF of the aluminium involved.

Then What is your curent density or what current you
applied for the area???...If you apply in Nanoamps or
C.D is lesser then by faradys laws,the deposition time
takes much longer..What anode u used??wither soluble
opper anode or insoluble stainless steel or lead or
inert anodes???..

The plating is quite easier to do provided you have to
take of C.D and anode..Be cautious that your anode
should be llargr than cathode for unifrom step
coverage..


Bala


--- "J.J wang"  wrote:

> Hi, Everyone
>
> I am trying to do electroplating copper for about 2
> to 5 um thickness on top of the sacrificial layer of
> polymer.
>
> Right now my lab has EPI E-Brite Ultra Cu solution,
> multimeter, hotplate, magnetic stiring bar,voltage
> source, electrode clamps. I connected the circuits
> with required current (10ASF), but seems the copper
> didn't grow on the seed layer which is also copper.
>
> I went back to the instruction sheet of the E-Brite
> Ultra Cu, it looked much more complicated than I
> thought. Does anybody have the experience using the
> E-Brite Ultra Cu solution ? Please give me some
> brief description of how to us it.
>
> My another question is: Can I use other materials as
> seed layer such as aluminium ?
>
> Any help will be appreciated. If you have experience
> with other plating solutions, it is also welcome, I
> don't have to restrain to one only material.