Hello All
I am working on fabrication of MEMS acoustic sensor.
 we bond a glass wafer with hole by anodic bonding on backside of chip to
compensate the acoustic pressure. Can anybody has idea to fabricate the chip in
such a way so that there is no need to do hole in glass wafer.
Thanks
  Aarti


Aarti Arora
Project Assistant & research Scholar,
MEMS & MicroSensors group,
Central Electronics Engineering Research Institute,
Pilani, INDIA