Him

This is very easy to do using ICP etching if this hole is the first step of
your process. Aspect ratio might be achieved up to 1:20 but 1:10 is already a
reasonnable challenge.

Laser machining silicon does give smooth sidewalls as compared to ICP.

Florian


Quoting Jeff chen :

> Hi,
>
> I am working on a project which needs to etch a hole through the
> silicon wafer (525 micron thick). The hole diameter is around 50
> micron.
> Does anyone have experience to do that?
> Is there any way to do that? Etching? Laser excimer? or grounding
> technology?