not sure if I am addressing your issue, but sputter deposition is more
of a conformal coating process, as compared to evaporation

in the past, on a 2x3" glass slide I have sputtered coatings on the
opposite side of the slide (the side facing away from the sputter
target) with the substrate lifted slightly off the substrate stage

so particles sputtered off the target had sufficient energy to bounce
around and reach the 'dark side of the moon'

the deposition rate is, as you might expect, orders of magnitude slower
on such off axis surfaces

so I would expect you would get a coating on the faces not parallel to
the surface of your sputter target, but the deposition rate would
decrease for such surfaces

this would not be the case for an evaporated coating

in my example, the off axis surface films have different
crystallographic character as well, which can be interesting

-----Original Message-----
From: [email protected]
[mailto:[email protected]] On Behalf Of Rupesh Sawant
Sent: Wednesday, April 12, 2006 8:20 PM
To: General MEMS discussion
Subject: [mems-talk] sputtering of metal on wet etched glass substrate


Is sputtering possible on a wet etched glass substrate. Especially when
electtrode has to be sputtered in the wet etched microchannel. i have a
reference in which the sputtering can be done on an etched glass
channel. But in that case the depth of the glass microchannel is 8 um.
So the sides of the microchannel is almost vertical.  The depth of my
microchannels on glass is 50 um. So in my case the isotropic etching
will have lot of effect on the side walls of the channel. Can sputtering
assure me a continuos electrode length within the channel.