This paper describes various parameter effects for the cryogenic DRIE
process.

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 11, NO. 4, AUGUST
2002 385
Guidelines for Etching Silicon MEMS Structures
Using Fluorine High-Density Plasmas at Cryogenic
Temperatures
Meint J. de Boer, J. G. E. (Han) Gardeniers, Henri V. Jansen, Edwin
Smulders, Melis-Jan Gilde, Gerard Roelofs,
Jay N. Sasserath, and Miko Elwenspoek, Associate Member, IEEE

On Apr 19, 2006, at 8:52 AM, K A Chan wrote:

> Hi,
> Does anyone have any DRIE process information (STS or Alcatel or
> Oxford system)