Hi,

Is it possible to achive sloped side wall (profile angle varying from 70
degree to 110 degree) with significant depth (~200-300 um) in DRIE process ?
has any one has achieved such kind of sloped trenches ?

I am trying to use BOSCH chemistry, playing with SF6, C4F8 flow rate and
platen power , but resultant variation is only 1-2 degree. Has any one
has experience in such case? Can i try only SF6 and O2 plasma (with out
C4F8) ?

I will thankful if any one can give some suggestion or can refer to some
literature related to this challenging task.

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Thanks,
Pradeep Dixit