Dear all,
        I got bubbles problems in  SU8.
I fabricated micro structures using SU-8 GM1060.
And I found that there are many bubbles in the SU8 layer. These bubbles
started to form at the beginning of  soft bake and can be visually
observed. Otherwise, I cannot see any bubbles right after spin coating
SU-8. Therefore, I excluded the reason of the air bubbles trapped in SU8
during I pour the PR on silicon wafer.  Is the temperture of softbak too
high? Dose anyone have the same problem? All suggestion or comment might
be helpful. Thanks a lot.

Fabrication Process

1. Carro's acid and BOE clean silicon wafer
2. Dehydration 120C  10min
3. Spin coating SU8
4. Softbake ramped hot plate 65C 10mins -->  95C 60mins --> Room
temperture  (bubbles began to form at the begining of softbake)
5. Expose
6. PEB
7. Develop
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Department of Mechanical Engineering, NCTU.
1001 TA HSUEH ROAD, HSINCHU, TAIWAN 30056,ROC
Chun-Wei Chang
Tel:886-3-512121 ext. 55149