hi all

I'm M Goré hamed , engineer in traineeship in a  company in France.
I have a question about silicon/ gold   eutectic Bonding.
I'm develloping this process in auxitrol a company located in France
which's scpecialized in aeronautic for pressures sensors.
Do you have some pratices advices to realize this bonding.
i hope to get some advices about thermal, time and pressure parameters to
realize the process.

Best Regards