Dear J. J. Wang,
Refer to your response to Terry Zhu, did you mean that you had used SU8 to form
a electroplating mould and successfully plated gold? you used Cr layer and then
Omnicoat, followed by SU8 processing, finally electrolytic gold plating, right?
if not, would you please correct me?
I did the similiar thing but based on silver rather than Cr. However, I failed
because SU8 layer lift off after I plated gold and cool down. I want to keep
the SU8 after plating because I want to plating another metal (Ni) on top of
Gold.
Would you please give me some advice?
Thanks a lot!
J. Zhu
> -----Original Message-----
> From: [email protected] [SMTP:[email protected]] On
Behalf Of polly
> Sent: 25 May 2006 13:04
> To: [email protected]
> Subject: [mems-talk] query
>
>
> dear Sir
>
> i would to know the critical post metalization temperature after which
aluminum spikes into silicon.