Dear All,

I used SU8 to form an electrolytic moulder on top of a thin layer Silver (100 nm
thick) and then plated gold for 2 mins (0.1 A for a plating area of 25 mmx25
mm). The difined features were plated ok, however SU8 together with silver layer
was lifted when it was took out of the solution and cooled down. I immersed
anothe sample in the same solution without applying current, SU8 stays well
under the similiar procedures. Can anyone give me a clue (chemical reaction?
stress?)?

Any responses are welcome!

Thanks in advance.

J. Zhu