Hi The gold will diffuse thru the Ti at your temp. at this temp you need TiW
barrier.

Shay

-----Original Message-----
From: [email protected] [mailto:[email protected]]
On Behalf Of [email protected]
Sent: Thursday, June 08, 2006 3:54 PM
To: General MEMS discussion
Subject: [mems-talk] question about anneal

Hello all,

after I anneal my sample (silicon substrate, Ti/Au=10/60 nm ) at around 550
oC in H2/N2=10/90%, the Au looks like melted.

I know there is a eutectic point for Au/Si, but Ti is between two layers.
when I increased the thickness of Ti to 50 nm. looks better, but it is still
not good enough(I can not wire bonder on the Au).

I read some papers claims they did anneal on the similar samples like me.
I do not know what's wrong.