Hi everybody,

I am trying to set up a tin plating system for our semiconductor application. We
want to plate Tin on top of the Cu post and bond 2 Cu posts together by
reflowing. Is there anyone having experience on that? We plan to use the Tin
plating process from Enthone Company. I wonder if we really need the filtration
and mechanical agitation just for our simple purpose of lining a thin layer of
Tin?

Thanks for any advice,
Best regards,
Trang