Guys.,

I electroplated Ni on Gold/Cr/Si (gold is seed layer).
But after few hrs.,Nickel adhesion is lost and gets
peeled off. I suppose this is due to the stress
initiated during Ni electrodeposition.

When viewing under microscope, The top surface of
Peeled Ni is rough., Bottom surface is very smooth.

Whether increasing the roughness of seed layer either
by plasma oxidation technique will help???.

Thanks

Bala.