We make a device where we do a step etch on a part of the device to
thin out that specific feature (thin it out for dampening).  We use HF to
perform the etch.  However, we form unwanted dominant pyramid features (due
to contamination and surface defects at the starting quartz plane) by the
time we end the etch.  Has anyone have any experience with removing these
unwanted features using laser micromachining (or any other method)?  Our
concern with this method would be its potential damage to the device
structure (micro fractures) as a result of forced ablation.  The pyramid
dimension are typically 40 um or higher, and 120 um wide or greater in the
base.

Ron Martin