Hi,

I guess E-beam evaporator gives you best quality film.

Sputtering is physical process of removal of material by bombardment of ions
on the target and depositing removed material on the substrate. However, it
does little physical damage to the wafer surface due to striking and
penetration of ions.

Evaporation gives a rather uniform film with good material characteristics.

Regards,
Suraj Kumar Patil


On 7/22/06, Sreemanth M Uppuluri  wrote:
>
> Hello All,
>
> Recently we got a sputtering machine that can deposit Aluminum thin films
> and I am trying to figure out which process - E-beam evaporation or
> Sputtering is best for depositing Aluminum thin films (thickness = 150 nm,
> surface roughenss < 10 nm, grain size - tens of nm, with good surface
> quality). Please let me know if you have any suggestions.