Hi Xiang,

I am surprised that your cleanroom allows you to use SU-8 as a mask for ICP
etching. SU-8 will dramatically contaminate your chamber. Why don't you use
thick negative resist ? Plus, it will be hard to remove your SU-8 etch mask
once your DRIE etch is done... I don't see any advantages to go for a SU-8
mask. Could you please give more information ?

typical recipes for SU-8 resist can be found on microchem.com

Regards,
Florian


Quoting "D. Zhou" :

> Dear all,
>
> I am trying to use SU-8 photoresist as the etch mask for the DRIE etch of
> Si substrate ( ~5um (or above) thick resist is needed). Did anyone have any
> experiences in this? What is the selectivity of the typical Bosh process
> between SU-8 and Si? And how can I pattern it (typical recipe for UV
> exposure and development)? I have not used SU-8 before and hope someone can
> give me a hand. Many thanks.

--
Florian Herrault, PhD student
Georgia Institute of Technology
791 Atlantic Dr., Atlanta, GA  30332-0269
ph:  404-894-9909; fax:  404-894-5028