Evaporate a thin film of Au on top of the In without a vacuum break.
500-1000A should be enough.  This will spontaneously form an In-Au alloy,
which will not oxidize.  Also, .35um seems a bit thin for wafer bonding.
You may want to thicken that up.

Gabriel


---------- Forwarded message ----------
> From: [email protected]
> To: [email protected]
> Date: Fri, 4 Aug 2006 09:57:54 -0400 (EDT)
> Subject: [mems-talk] Indium evaporation
> Hello,
> I am trying to e-beam evaporate .35 microns indium on silicon with Ti/Au
> on it. I am getting milky looking film instead of a shiny, aluminum like
> film.
> I am using indium shots 99.9999% using a moly liner in a AJA system.
> This oxide prohibits me to bond this In coated wafer to another Au coated
> wafer.
> Has anyone else encoutered the same issue with indium evap. How to get rid
> of the oxide.