You could try Piranha cleaning too.


Quoting "D. Zhou" :

> Dear all,
>
> I used S1813 as the mask for the DRIE of the top layer from the front-side.
> Then I put the chip upside down, attached it to an Oxide wafer and did
> another DRIE of the substrate from the back-side . After the etch, I found
> it difficult to remove the polymer formed during the etch. I dip my chips
> in Aceton for 10 mins and then used Oxygen plasmer to clean it. However,
> the top layer(device layer) of my chips were still not clean enough. Could
> anybody give me some suggestions on how to completely clean the chips after
> these two DRIE process? Thanks very much.
>

--
Florian Herrault, PhD student
Georgia Institute of Technology
791 Atlantic Dr., Atlanta, GA  30332-0269
ph:  404-894-9909; fax:  404-894-5028