for Bosch polymer, Dupont EKC 270 or CF4 ash will also get it.

D. Zhou wrote:

> Dear all,
>
> I used S1813 as the mask for the DRIE of the top layer from the
> front-side. Then I put the chip upside down, attached it to an Oxide
> wafer and did another DRIE of the substrate from the back-side . After
> the etch, I found it difficult to remove the polymer formed during the
> etch. I dip my chips in Aceton for 10 mins and then used Oxygen
> plasmer to clean it. However, the top layer(device layer) of my chips
> were still not clean enough. Could anybody give me some suggestions on
> how to completely clean the chips after these two DRIE process? Thanks
> very much.
>