Shay, what comes first to mind is to use a metal bonded diamond impregnated
wheel.  Gary

Gary Hillman
Service Support Specialties, Inc.
9 Mars Court
PO Box 365
Montville, NJ 07045
973-263-0640
973-263-8888.



-----Original Message-----
From:   Shay Kaplan [SMTP:[email protected]]
Sent:   Tuesday, August 22, 2006 10:47 AM
To:     'General MEMS discussion'
Subject:        [mems-talk] Dicing sapphire


Hi everyone,
I'm trying to cut sapphire wafers, ~300u thick, and I experience a very high
blade ware - microns per cm cut.
I'm using resin blades with ~45u size diamond and progressive cutting.
Anyone has any experience with sapphire dicing? What blades, spindle speed
and table speed should one use?

Thanks
Shay